Abstract
Silicon Carbide based power electronics use electrical energy significantly more efficient than current silicon-based semiconductors: gains from 6% to 30% are expected depending on application. TRANSFORM will provide European downstream market players with a reliable source of SiC components and systems based on an entirely European value chain - from substrates to energy converters. Its technical excellence strengthens the global competitive position of Europe. TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry. Substrate manufacturing process innovation will establish a new global standard: smart-cut technology allows high scalability, superior performance and reliability. Substrate and equipment manufacturers plus technology providers cooperate to increase maturity of the new processes from lab demonstration to pilot lines. Device manufacturers develop and tailor processes and device design based on the new substrate process, including adaptation of planarMOS and development of new TrenchMOS technology. Performance and reliability of devices is expected to increase greatly. For exploiting the potential of SiC devices, integration technologies and system design are improved concurrently, including new copper metallization processes for higher reliability and performance, module integration for high reliability and reduction of cost, and dedicated integrated driver technologies to optimize switching modes and parallel operation in high current applications. The project will demonstrate energy savings in applications (DC/AC, DC/DC, AC/DC) in the renewable energy domain, industry and automotive. TRANSFORM contributes to European societal goals and the green economy through significantly increasing energy efficiency by providing a competitive, ready-to-industrialized technology, strengthening Europes technological sovereignty in a critical field.
Project details
Unibo Team Leader: Claudio Fiegna
Unibo involved Department/s:
Centro di Ricerca sui Sistemi Elettronici per l'Ingegneria dell'Informazione e delle Telecomunicazioni "Ercole De Castro" - ARCES (Advanced Research Center on Electronic System)
Coordinator:
Robert Bosch Gmbh(Germany)
Other Participants:
Fraunhofer Ipa
(Germany)
Linkopings Universitet
(Sweden)
Stmicroelectronics Silicon Carbide Ab
(Sweden)
Cea-Commissariat A L'Energie Atomique Et Aux Energies Alternatives
(France)
Saint Gobain Recherche Sas
(France)
Applied Materials France
(France)
Saint-Gobain Industriekeramik Rodental Gmbh
(Germany)
Danfoss Silicon Power Gmbh
(Germany)
Isle Steuerungstechnik Und Leistungselektronik Gmbh
(Germany)
Nano-Join Gmbh
(Germany)
Universidad De Sevilla
(Spain)
Premo S.A.U.
(Spain)
Vysoke Uceni Technicke V Brne-Technical University Of Brno
(Czech Republic)
S.O.I.Tec Silicon On Insulator Technologies Sa
(France)
Hpe Srl
(Italy)
Hochschule Hamm-Lippstadt
(Germany)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica
(Italy)
Lasertec Usa Inc
(United States of America)
Technische Universität Chemnitz
(Germany)
Technische Universitaet Kaiserslautern
(Germany)
Suragus Gmbh
(Germany)
Forschungs- Und Entwicklungszentrum Fachhochschule Kiel Gmbh
(Germany)
Tplus Engineering Gmbh
(Germany)
Centrotherm International Ag
(Germany)
Ev Group E. Thallner Gmbh
(Austria)
Institut Mikroelektronickych Aplikaci S.R.O.
(Czech Republic)
Novasic Sa
(France)
STMicroelectronics S.r.l.
(Italy)
Valeo Siemens E Automotive France Sas
(France)
Mersen France Gennevilliers Sas
(France)
Semikron Elektronik Gmbh & Co. Kg
(Germany)
École Centrale de Lille
(France)
Aixtron Ag
(Germany)
Soitec Lab
(France)
Third parties:
ALMA MATER STUDIORUM - Università di Bologna
(Italy)
Total Eu Contribution: Euro (EUR) 20.738.434,68
Project Duration in months: 36
Start Date:
01/05/2021
End Date:
30/04/2024
Cordis webpage
Project website
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 101007237