Abstract
R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot. Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)
Project details
Unibo Team Leader: Claudio Fiegna
Coordinator:
STMicroelectronics S.r.l.(Italy)
Other Participants:
Advanced Packaging Center Bv
(Netherlands)
Automatix Sp. z o. o.
(Poland)
Applied Materials France
(France)
DISCO HI-TEC EUROPE GmbH
(Germany)
Applied Materials Ireland Limited
(Ireland)
Besi Austria GmbH
(Austria)
Ev Group E. Thallner Gmbh
(Austria)
Laser Systems & Solutions Of Europe
(France)
Universitatea Politehnica Din Bucuresti
(Romania)
Institut Mikroelektronickych Aplikaci S.R.O.
(Czech Republic)
AP&S International GmbH
(Germany)
Atotech Deutschland Gmbh
(Germany)
Politecnico di TORINO
(Italy)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica
(Italy)
Slovenská technická univerzita v Bratislave - Slovak University of Technology in Bratislava
(Slovak Republic)
Applied Materials Israel Ltd
(Israel)
Nova Measuring Instruments Ltd
(Israel)
Instytut Technologii Elektronowej
(Poland)
Siltronic Ag
(Germany)
Consiglio Nazionale Delle Ricerche
(Italy)
Green Power Technologies, S.L.
(Spain)
Vysoke Uceni Technicke V Brne-Technical University Of Brno
(Czech Republic)
ancosys GmbH
(Germany)
KLA-Tencor MIE GmbH
(Germany)
Picosun Oy
(Finland)
S.O.I.Tec Silicon On Insulator Technologies Sa
(France)
Lam Research Sas
(France)
Università di PISA
(Italy)
Asm Europe Bv
(Netherlands)
Universidad De Sevilla
(Spain)
Università degli Studi di PAVIA
(Italy)
NanoDesign ltd.
(Slovak Republic)
Icos Vision Systems Nv
(Belgium)
Robert Bosch Gmbh
(Germany)
Third parties:
Università degli Studi di PADOVA
(Italy)
Total Eu Contribution: Euro (EUR) 28.046.206,50
Project Duration in months: 42
Start Date:
01/11/2017
End Date:
30/04/2021
This project contributes to the achievement of the Sustainable Development Goals of the UN 2030 Agenda.
This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No
737417
Alumni