R3-PowerUP

300mm Pilot Line for Smart Power and Power Discretes

Abstract

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot. Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)​

Project details

Unibo Team Leader: Claudio Fiegna

Coordinator:
STMicroelectronics S.r.l.(Italy)

Other Participants:
S.O.I.Tec Silicon On Insulator Technologies Sa (France)
Applied Materials France (France)
Università  degli Studi di PAVIA (Italy)
Politecnico di TORINO (Italy)
Institut Mikroelektronickych Aplikaci S.R.O. (Czech Republic)
Applied Materials Ireland Limited (Ireland)
Nova Measuring Instruments Ltd (Israel)
Slovenská technická univerzita v Bratislave - Slovak University of Technology in Bratislava (Slovak Republic)
Vysoke Uceni Technicke V Brne-Technical University Of Brno (Czech Republic)
Laser Systems & Solutions Of Europe (France)
DISCO HI-TEC EUROPE GmbH (Germany)
Atotech Deutschland Gmbh (Germany)
KLA-Tencor MIE GmbH (Germany)
Applied Materials Israel Ltd (Israel)
Universitatea Politehnica Din Bucuresti (Romania)
Green Power Technologies, S.L. (Spain)
Lam Research Sas (France)
Asm Europe Bv (Netherlands)
Instytut Technologii Elektronowej (Poland)
Picosun Oy (Finland)
Universidad De Sevilla (Spain)
NanoDesign ltd. (Slovak Republic)
Icos Vision Systems Nv (Belgium)
ancosys GmbH (Germany)
AP&S International GmbH (Germany)
Siltronic Ag (Germany)
Consiglio Nazionale Delle Ricerche (Italy)
Advanced Packaging Center Bv (Netherlands)
Besi Austria GmbH (Austria)
Università  di PISA (Italy)
Automatix Sp. z o. o. (Poland)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica (Italy)
Ev Group E. Thallner Gmbh (Austria)
Robert Bosch Gmbh (Germany)

Third parties:
Università  degli Studi di PADOVA (Italy)

Total Eu Contribution: Euro (EUR) 28.046.206,50
Project Duration in months: 42
Start Date: 01/11/2017
End Date: 30/04/2021

Cordis webpage

Affordable and clean energy This project contributes to the achievement of the Sustainable Development Goals of the UN 2030 Agenda.

UE flag This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 737417