Abstract
Intelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, worldleading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
Project details
Unibo Team Leader: Claudio Fiegna
Unibo involved Department/s:
Centro di Ricerca sui Sistemi Elettronici per l'Ingegneria dell'Informazione e delle Telecomunicazioni "Ercole De Castro" - ARCES (Advanced Research Center on Electronic System)
Coordinator:
Infineon Technologies Ag(Germany)
Other Participants:
Sirris Het Collectief Centrum Van De Technologische Industrie
(Belgium)
On Semiconductor Belgium Bvba
(Belgium)
Aalto University Foundation
(Finland)
Pumacy Technologies Ag
(Germany)
Schweizer Electronic Ag
(Germany)
Universitaet Bremen
(Germany)
Foundation for Research and Technology - HELLAS
(Greece)
Tekne S.R.L.
(Italy)
Jiaco Instruments Bv
(Netherlands)
Nexperia B.V.
(Netherlands)
Slovenská technická univerzita v Bratislave - Slovak University of Technology in Bratislava
(Slovak Republic)
Avl List Gmbh
(Austria)
Westsachsische Hochschule Zwickau
(Germany)
Fraunhofer Ipa
(Germany)
ELMOS Semiconductor AG
(Germany)
Enforma Bilisim Anonim Sirketi
(Turkey)
Technische Universität Wien
(Austria)
Ninix Technologies Nv
(Belgium)
IMEC vzw
(Belgium)
Okmetic Oyj
(Finland)
Alcatel Thales Iii V Lab
(France)
The Universite Claude Bernard Lyon
(France)
Laser Imaging Systems Gmbh
(Germany)
Gopel Electronic Gmbh
(Germany)
Robert Bosch Semiconductor Manufacturing Dresden Gmbh
(Germany)
Forschungs- Und Transferzentrum Ev An Der Westsaechsischen Hochschule Zwickau
(Germany)
Lec Gmbh
(Germany)
Batz Sociedad Cooperativa
(Spain)
Agencia Estatal Consejo Superior De Investigaciones Cientificas (Csic)
(Spain)
Knowledge Centric Solutions Sl
(Spain)
Swerea Ivf Ab
(Sweden)
Marmara Üniversitesi - Marmara University
(Turkey)
Arcelik A.S.
(Turkey)
Virtual Vehicle Research Gmbh - Vif
(Austria)
Kai Kompetenzzentrum Automobil - Und Industrieelektronik Gmbh
(Austria)
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
(Austria)
AMS-Austriamicrosystems AG
(Austria)
Technische Universitaet Graz
(Austria)
Thales SA
(France)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica
(Italy)
Iwo Project Bv
(Netherlands)
Elaphe Pogonske Tehnologije Doo
(Slovenia)
Universidad De Castilla - La Mancha
(Spain)
Inmotion Technologies Ab
(Sweden)
Qrtech Aktiebolag
(Sweden)
Infineon Technologies Austria Ag
(Austria)
Infineon Technologies It-Services Gmbh
(Austria)
United Monolithic Semiconductors S.A.S
(France)
Technische Universität Chemnitz
(Germany)
X-Fab Semiconductor Foundries Gmbh
(Germany)
Lfoundry Srl
(Italy)
Infineon Technologies Italia S.R.L
(Italy)
Technische Universiteit Delft - Delft University Of Technology
(Netherlands)
Signify Netherlands Bv
(Netherlands)
Ulma Embedded Solutions S Coop
(Spain)
Teknologian Tutkimuskeskus Vtt
(Finland)
Screentec Oy
(Finland)
Bsh Electrodomesticos Espana Sa
(Spain)
Construcciones y Auxiliar de Ferrocarriles, S.A.
(Spain)
Alter Technology Tuv Nord Sa
(Spain)
Edr & Medeso Ab
(Sweden)
Pavo Tasarim Uretim Elektronik Ticaret Anonim Sirketi
(Turkey)
Mindcet Nv
(Belgium)
Technische Universitat Dresden
(Germany)
Infineon Technologies Dresden GmbH
(Germany)
Sensitec Gmbh
(Germany)
Atep - Amkor Technology Portugal Sa
(Portugal)
Ikerlan S.Coop.
(Spain)
Scania Cv Ab
(Sweden)
NanoDesign ltd.
(Slovak Republic)
Materials Center Leoben Forschung GmbH
(Austria)
Plastic Omnium Advanced Innovationand Research
(Belgium)
Forciot Oy
(Finland)
HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v.
(Germany)
X-FAB Dresden GmbH & Co. KG
(Germany)
Università degli Studi dell'Aquila
(Italy)
Jozef Stefan Institute
(Slovenia)
Universidad Carlos Iii De Madrid
(Spain)
Third parties:
ALMA MATER STUDIORUM - Università di Bologna
(Italy)
Total Eu Contribution: Euro (EUR) 25.371.964,71
Project Duration in months: 42
Start Date:
01/05/2020
End Date:
31/10/2023
This project contributes to the achievement of the Sustainable Development Goals of the UN 2030 Agenda.
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 876659