Abstract
Intelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, worldleading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
Project details
Unibo Team Leader: Claudio Fiegna
Unibo involved Department/s:
Centro di Ricerca sui Sistemi Elettronici per l'Ingegneria dell'Informazione e delle Telecomunicazioni "Ercole De Castro" - ARCES (Advanced Research Center on Electronic System)
Coordinator:
Infineon Technologies Ag(Germany)
Other Participants:
On Semiconductor Belgium Bvba
(Belgium)
Sirris Het Collectief Centrum Van De Technologische Industrie
(Belgium)
Aalto University Foundation
(Finland)
Universitaet Bremen
(Germany)
Pumacy Technologies Ag
(Germany)
Schweizer Electronic Ag
(Germany)
Foundation for Research and Technology - HELLAS
(Greece)
Tekne S.R.L.
(Italy)
Nexperia B.V.
(Netherlands)
Jiaco Instruments Bv
(Netherlands)
Slovenská technická univerzita v Bratislave - Slovak University of Technology in Bratislava
(Slovak Republic)
Avl List Gmbh
(Austria)
Fraunhofer Ipa
(Germany)
ELMOS Semiconductor AG
(Germany)
Westsachsische Hochschule Zwickau
(Germany)
Enforma Bilisim Anonim Sirketi
(Turkey)
Technische Universität Wien
(Austria)
Ninix Technologies Nv
(Belgium)
Okmetic Oyj
(Finland)
The Universite Claude Bernard Lyon
(France)
Alcatel Thales Iii V Lab
(France)
Gopel Electronic Gmbh
(Germany)
Lec Gmbh
(Germany)
Laser Imaging Systems Gmbh
(Germany)
Robert Bosch Semiconductor Manufacturing Dresden Gmbh
(Germany)
Forschungs- Und Transferzentrum Ev An Der Westsaechsischen Hochschule Zwickau
(Germany)
Agencia Estatal Consejo Superior De Investigaciones Cientificas (Csic)
(Spain)
Knowledge Centric Solutions Sl
(Spain)
Batz Sociedad Cooperativa
(Spain)
Swerea Ivf Ab
(Sweden)
Arcelik A.S.
(Turkey)
Marmara Üniversitesi - Marmara University
(Turkey)
AMS-Austriamicrosystems AG
(Austria)
Virtual Vehicle Research Gmbh - Vif
(Austria)
Technische Universitaet Graz
(Austria)
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
(Austria)
Kai Kompetenzzentrum Automobil - Und Industrieelektronik Gmbh
(Austria)
Thales SA
(France)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica
(Italy)
Iwo Project Bv
(Netherlands)
Elaphe Pogonske Tehnologije Doo
(Slovenia)
Universidad De Castilla - La Mancha
(Spain)
Inmotion Technologies Ab
(Sweden)
Qrtech Aktiebolag
(Sweden)
Infineon Technologies Austria Ag
(Austria)
Infineon Technologies It-Services Gmbh
(Austria)
Imec
(Belgium)
United Monolithic Semiconductors S.A.S
(France)
Technische Universität Chemnitz
(Germany)
X-Fab Semiconductor Foundries Gmbh
(Germany)
Infineon Technologies Italia S.R.L
(Italy)
Lfoundry Srl
(Italy)
Technische Universiteit Delft - Delft University Of Technology
(Netherlands)
Signify Netherlands Bv
(Netherlands)
Ulma Embedded Solutions S Coop
(Spain)
Screentec Oy
(Finland)
Teknologian Tutkimuskeskus Vtt
(Finland)
Construcciones y Auxiliar de Ferrocarriles, S.A.
(Spain)
Bsh Electrodomesticos Espana Sa
(Spain)
Alter Technology Tuv Nord Sa
(Spain)
Edr & Medeso Ab
(Sweden)
Pavo Tasarim Uretim Elektronik Ticaret Anonim Sirketi
(Turkey)
Mindcet Nv
(Belgium)
Technische Universitat Dresden
(Germany)
Infineon Technologies Dresden GmbH
(Germany)
Sensitec Gmbh
(Germany)
Atep - Amkor Technology Portugal Sa
(Portugal)
Ikerlan S.Coop.
(Spain)
Scania Cv Ab
(Sweden)
NanoDesign ltd.
(Slovak Republic)
Materials Center Leoben Forschung GmbH
(Austria)
Plastic Omnium Advanced Innovationand Research
(Belgium)
Forciot Oy
(Finland)
X-FAB Dresden GmbH & Co. KG
(Germany)
HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v.
(Germany)
Università degli Studi dell'Aquila
(Italy)
Jozef Stefan Institute
(Slovenia)
Universidad Carlos Iii De Madrid
(Spain)
Third parties:
ALMA MATER STUDIORUM - Università di Bologna
(Italy)
Total Eu Contribution: Euro (EUR) 25.371.964,71
Project Duration in months: 36
Start Date:
01/05/2020
End Date:
30/04/2023
This project contributes to the achievement of the Sustainable Development Goals of the UN 2030 Agenda.
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 876659