iRel40

Intelligent Reliability 4.0

Abstract

Intelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, worldleading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.

Project details

Unibo Team Leader: Claudio Fiegna

Coordinator:
Infineon Technologies Ag(Germany)

Other Participants:
AMS-Austriamicrosystems AG (Austria)
Infineon Technologies It-Services Gmbh (Austria)
Infineon Technologies Dresden GmbH (Germany)
X-FAB Dresden GmbH & Co. KG (Germany)
Bsh Electrodomesticos Espana Sa (Spain)
Inmotion Technologies Ab (Sweden)
Marmara Üniversitesi - Marmara University (Turkey)
Technische Universität Wien (Austria)
ViF-Kompetenzzentrum - Das Virtuelle Fahrzeug, Forschungsgesellschaft mbH (Austria)
Technische Universitaet Graz (Austria)
Sirris Het Collectief Centrum Van De Technologische Industrie (Belgium)
Teknologian Tutkimuskeskus Vtt (Finland)
Forciot Oy (Finland)
Universitaet Bremen (Germany)
Fraunhofer Ipa (Germany)
Technische Universität Chemnitz (Germany)
Robert Bosch Semiconductor Manufacturing Dresden Gmbh (Germany)
Infineon Technologies Italia S.R.L (Italy)
Elaphe Pogonske Tehnologije Doo (Slovenia)
Universidad De Castilla - La Mancha (Spain)
Arcelik A.S. (Turkey)
Enforma Bilisim Anonim Sirketi (Turkey)
Avl List Gmbh (Austria)
At & S Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
Kai Kompetenzzentrum Automobil - Und Industrieelektronik Gmbh (Austria)
Schweizer Electronic Ag (Germany)
Nexperia B.V. (Netherlands)
Technische Universiteit Delft - Delft University Of Technology (Netherlands)
Atep - Amkor Technology Portugal Sa (Portugal)
Ulma Embedded Solutions S Coop (Spain)
Infineon Technologies Austria Ag (Austria)
On Semiconductor Belgium Bvba (Belgium)
Ninix Technologies Nv (Belgium)
Alcatel Thales Iii V Lab (France)
Thales SA (France)
Technische Universitat Dresden (Germany)
Pumacy Technologies Ag (Germany)
HAHN-SCHICKARD-GESELLSCHAFT FUER ANGEWANDTE FORSCHUNG E.v. (Germany)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica (Italy)
Iwo Project Bv (Netherlands)
Jiaco Instruments Bv (Netherlands)
Ikerlan S.Coop. (Spain)
Qrtech Aktiebolag (Sweden)
Slovenská technická univerzita v Bratislave - Slovak University of Technology in Bratislava (Slovak Republic)
Mindcet Nv (Belgium)
Aalto University Foundation (Finland)
Screentec Oy (Finland)
Lec Gmbh (Germany)
Laser Imaging Systems Gmbh (Germany)
Forschungs- Und Transferzentrum Ev An Der Westsaechsischen Hochschule Zwickau (Germany)
Foundation for Research and Technology - HELLAS (Greece)
Signify Netherlands Bv (Netherlands)
Plastic Omnium Advanced Innovationand Research (Belgium)
Okmetic Oyj (Finland)
United Monolithic Semiconductors S.A.S (France)
Sensitec Gmbh (Germany)
Batz Sociedad Cooperativa (Spain)
Edr & Medeso Ab (Sweden)
Imec (Belgium)
Westsachsische Hochschule Zwickau (Germany)
X-Fab Semiconductor Foundries Gmbh (Germany)
Università degli Studi dell'Aquila (Italy)
Pavo Tasarim Uretim Elektronik Ticaret Anonim Sirketi (Turkey)
Materials Center Leoben Forschung GmbH (Austria)
The Universite Claude Bernard Lyon (France)
ELMOS Semiconductor AG (Germany)
Gopel Electronic Gmbh (Germany)
Tekne S.R.L. (Italy)
Lfoundry Srl (Italy)
Jozef Stefan Institute (Slovenia)
Agencia Estatal Consejo Superior De Investigaciones Cientificas (Csic) (Spain)
Construcciones y Auxiliar de Ferrocarriles, S.A. (Spain)
Universidad Carlos Iii De Madrid (Spain)
Alter Technology Tuv Nord Sa (Spain)
Knowledge Centric Solutions Sl (Spain)
Scania Cv Ab (Sweden)
Swerea Ivf Ab (Sweden)
NanoDesign ltd. (Slovak Republic)

Third parties:
ALMA MATER STUDIORUM - Università di Bologna (Italy)

Total Eu Contribution: Euro (EUR) 25.371.964,71
Project Duration in months: 36
Start Date: 01/05/2020
End Date: 30/04/2023

Cordis webpage

Industry, innovation and infrastructure This project contributes to the achievement of the Sustainable Development Goals of the UN 2030 Agenda.

UE flag This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 876659