59447 - Advanced Topics in Electronics L

Learning outcomes

The goal of the course is to provide additional knowledge to electronic designer especially analyzing the implications of the technological implementation over the electronic system efficiency. The course will be structured by concurrently analyzing the photolithograhy based technology used for both discrete and integrated components platforms. The course will tackle the issues of signal propagations, packaging, heat management and noise reduction on electronic systems

Course contents

- Photolithography technologies for integrated and printed circuit boards
- Small signal analysis for MOS elementary circuits for advanced analog design
- Physical realization of high performance boards. Packaging and heat transfer. Electronic boards technologies.
- Signal handling on silicon and electronic boards. Lump and distributed models of interconnections.
- Glitches and related reduction techniques. Cross-talk and jitter.
- Clock and power supply distributions over the boards. Techniques for reduction of noise in electronic boards.
- Analog-to-digital (A/D) conversion at Niquist rate: successive approximation and flash converters.
- Oversampled A/D converters. Sigma-Delta modulation and noise shaping. Pipelined Sigma-Delta converters. Trade-offs in A/D converters choice.

Readings/Bibliography

H.B. BAKOGLU CIRCUITS INTERCONNECTIONS AND PACKAGING FOR VLSI
ADDISON-WESLEY 1990 S. HALL G. HALL J. MCCALL HIGH-SPEED DIGITAL SYSTEM
DESIGN WILEY 2000

D. Johns, K. Martin, Analog Integrated Circuit Design, Wiley, 1997

Teaching methods

Classrom teaching and discussion

Assessment methods

Individual oral discussion (40min)

Teaching tools

Hand written lectures (80%). Slides (20%)

Office hours

See the website of Marco Tartagni