Reggiani, Susanna; Balestra, Luigi; Gnudi, Antonio; Gnani, Elena; Baccarani, Giorgio; Dobrzynska, Jagoda; Vobecky, Jan; Tosi, Carlo, TCAD Investigation of Differently-Doped DLC Passivation for Large-Area High-Power Diodes, «IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS», 2021, 9, Article number: 8801920 , pp. 2155 - 2162 [Scientific article]
Carapezzi S.; Reggiani S.; Gnani E.; Gnudi A., Electron mobility of strained InGaAs long-channel MOSFETs: From scattering rates to TCAD model, «SOLID-STATE ELECTRONICS», 2020, 172, Article number: 107902 , pp. 1 - 7 [Scientific article]
Gnani E.; Malago P.; Gnudi A.; Reggiani S., New DG FeFET topology with enhanced SS and non-hysteretic behavior, «SOLID-STATE ELECTRONICS», 2020, 168, Article number: 107727 , pp. 107727 - 107731 [Scientific article]
Carapezzi S.; Reggiani S.; Gnani E.; Gnudi A., TCAD Simulation Framework of Gas Desorption in CNT FET NO2Sensors, «IEEE TRANSACTIONS ON ELECTRON DEVICES», 2020, 67, Article number: 9199415 , pp. 4682 - 4686 [Scientific article]
Luigi Balestra, Susanna Reggiani, Antonio Gnudi, Elena Gnani, Jagoda Dobrzynska, Jan Vobecký, TCAD Study of VLD Termination in Large-Area Power Devices Featuring a DLC Passivation, «IEEE TRANSACTIONS ON ELECTRON DEVICES», 2020, 67, pp. 4645 - 4648 [Scientific article]
Gnani E.; Malago P.; Reggiani S.; Gnudi A., New DG FeFET architecture with enhanced SS and non-hysteretic behaviour, in: 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019, Institute of Electrical and Electronics Engineers Inc., 2019, pp. 1 - 4 (atti di: 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2019, fra, 2019) [Contribution to conference proceedings]
Balestra L.; Reggiani S.; Gnudi A.; Gnani E.; Baccarani G.; Dobrzynska J.; Vobecky J., Numerical investigation of the leakage current and blocking capabilities of high-power diodes with doped dlc passivation layers, in: International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, Institute of Electrical and Electronics Engineers Inc., 2019, 2019-, pp. 1 - 4 (atti di: 24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019, Palazzo di Toppo Wassermann, ita, 2019) [Contribution to conference proceedings]
Carapezzi S.; Reggiani S.; Gnani E.; Gnudi A., On the electron mobility of strained InGaAs channel MOSFETs, in: European Solid-State Device Research Conference, Editions Frontieres, 2019, 2019-, pp. 266 - 269 (atti di: 49th European Solid-State Device Research Conference, ESSDERC 2019, pol, 2019) [Contribution to conference proceedings]
Gnani E.; Visciarelli M.; Gnudi A.; Reggiani S.; Baccarani G., TFET inverter static and transient performances in presence of traps and localized strain, «SOLID-STATE ELECTRONICS», 2019, 159, pp. 38 - 42 [Scientific article]
Cornigli, Davide*; Reggiani, Susanna; Gnudi, Antonio; Gnani, Elena; Baccarani, Giorgio; Fabiani, Davide; Varghese, Dhanoop; Tuncer, Enis; Krishnan, Srikanth; Nguyen, Luu, Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents, «IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION», 2018, 25, Article number: 8561350 , pp. 2421 - 2428 [Scientific article]Open Access
Cornigli, D.*; Reggiani, S.; Gnudi, A.; Gnani, E.; Baccarani, G.; Fabiani, D.; Varghese, D.; Tuncer, E.; Krishnan, S.; Nguyen, L., Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture, «MICROELECTRONICS RELIABILITY», 2018, 88-90, pp. 752 - 755 [Scientific article]Open Access
Reggiani, S.; Balestra, L.; Gnudi, A.*; Gnani, E.; Baccarani, G.; Dobrzynska, J.; Vobecký, J.; Tosi, C., TCAD study of DLC coatings for large-area high-power diodes, «MICROELECTRONICS RELIABILITY», 2018, 88-90, pp. 1094 - 1097 [Scientific article]
Gnani, E.; Gnudi, A.; Reggiani, S.; Baccarani, G.; Visciarelli, M., TFET-based inverter performance in the presence of traps and localized strain, in: 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2018, Institute of Electrical and Electronics Engineers Inc., 2018, 2018-, pp. 1 - 4 (atti di: 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI-ULIS 2018, esp, 2018) [Contribution to conference proceedings]
Stefania Carapezzi; Sebastian Eberle; Susanna Reggiani; Elena Gnani; Cosmin Roman; Christofer Hierold; Antonio Gnudi, 3D TCAD modeling of NO2CNT FET sensors, in: 48th European Solid-State Device Research Conference (ESSDERC) : Dresden, 3-6 september 2018, Piscataway ; Red Hook ; Gif-sur-Yvette, Institute of Electrical and Electronics Engineers ( IEEE ) ; Curran Associates, 2018, CFP18543-POD, pp. 222 - 225 (atti di: 48th European Solid-State Device Research Conference, ESSDERC 2018, Dresden, 3 - 6 Settembre 2018) [Contribution to conference proceedings]Open Access
Visciarelli, Michele; Gnani, Elena; Gnudi, Antonio; Reggiani, Susanna; Baccarani, Giorgio, Design guidelines for GaSb/InAs TFET exploiting strain and device size, «SOLID-STATE ELECTRONICS», 2017, 129, pp. 157 - 162 [Scientific article]
