Balestra, L.; Di Stasi, S.; Gnani, E.; Reggiani, S.; Chen, M. -Y.; Iwai, H.; Chang, E. Y., Impact of interface traps on the subthreshold performance of InGaAs nanosheet transistors, «SOLID-STATE ELECTRONICS», 2026, 231, Article number: 109265, pp. 109265-1 - 109265-4 [articolo]
Ercolano, F.; Balestra, L.; Krause, S.; Leone, S.; Streicher, I.; Waltereit, P.; Dammann, M.; Reggiani, S., Reliability of AlScN/GaN HEMTs Under Pulsed Measurements and HTRB Step-Stress Tests: Experimental and TCAD Insights, «IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY», 2026, 14, pp. 1 - 9 [articolo]
Balestra, L.; Rossetti, M.; Gnani, E.; Reggiani, S., Impact of water absorption on electrical properties of epoxy composite polymers: Suppressed charge trapping and enhanced ion transport, «JOURNAL OF APPLIED PHYSICS», 2025, 138, Article number: 025105, pp. 025105-1 - 025105-13 [articolo]
Balestra, L.; Gnani, E.; Reggiani, S.; Rossetti, M.; Depetro, R., In-Package Measurements of Space-Charge Accumulation in Epoxy Mold Compound Through Silicon Integrated Charge Sensors, in: Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, Institute of Electrical and Electronics Engineers Inc., 2025, pp. 588 - 591 (atti di: 100th IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2025, Conference Centre at the University of Manchester, Nancy Rothwell Building, Booth St E, gbr, 2025) [Contributo in Atti di convegno]
Ercolano, F.; Balestra, L.; Krause, S.; Leone, S.; Streicher, I.; Waltereit, P.; Dammann, M.; Reggiani, S., TCAD analysis of the high-temperature reverse-bias stress on AlGaN/GaN HEMTs, «POWER ELECTRONIC DEVICES AND COMPONENTS», 2025, 10, Article number: 100080, pp. 1 - 7 [articolo]Open Access
Balestra, L.; Gnani, E.; Rossetti, M.; Depetro, R.; Reggiani, S., Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs, «IEEE TRANSACTIONS ON ELECTRON DEVICES», 2024, 71, pp. 2565 - 2569 [articolo]Open Access
Balestra, L.; Gnani, E.; Reggiani, S.; Rossetti, M.; Depetro, R., Characterization and TCAD Simulation of the Electrostatic Potential Distortion in HV-ICs due to Losses in the Epoxy Mold Compound, in: Proceedings of the 2024 IEEE Latin American Electron Devices Conference, 345 E 47TH ST, NEW YORK, NY 10017 USA, IEEE, 2024, pp. 286 - 289 (atti di: 2024 IEEE Latin American Electron Devices Conference, LAEDC 2024, Guatemala City, 8 May 2024) [Contributo in Atti di convegno]
Balestra, L.; Riaz, M. T.; Giuliano, F.; Cavallini, A.; Reggiani, S.; Oldani, L.; Guarnera, S. S.; Rossetti, M.; Depetro, R., Dielectric Breakdown of in-Package Epoxy Mold Compound under Wet and Dry Conditions: Frequency and Temperature dependence, in: Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024, Institute of Electrical and Electronics Engineers Inc., 2024, pp. 690 - 694 (atti di: 26th Electronics Packaging Technology Conference, EPTC 2024, Grand Copthorne Waterfront Hotel, sgp, 2024) [Contributo in Atti di convegno]
Balestra L.; Cirioni L.; Cavallini A.; Reggiani S.; Rossetti M.; Gallo M.; Guarnera S.; Depetro R., Anomalous increase of leakage current in epoxy moulding compounds under wet conditions, «SOLID-STATE ELECTRONICS», 2023, 208, Article number: 108728, pp. 1 - 4 [articolo]Open Access
Ercolano, F.; Balestra, L.; Krause, S.; Leone, S.; Streicher, I.; Waltereit, P.; Dammann, M.; Reggiani, S., Role of trapping/detrapping in HTRB Stress and pulsed DC conditions in AlGaN/GaN HEMTs analyzed via TCAD simulations, in: IEEE International Integrated Reliability Workshop Final Report, Piscataway, Institute of Electrical and Electronics Engineers Inc., 2023, pp. 1 - 7 (atti di: 2023 IEEE International Integrated Reliability Workshop, IIRW 2023, South Lake Tahoe, CA, USA, 2023) [Contributo in Atti di convegno]Open Access
Zunarelli L.; Balestra L.; Reggiani S.; Sankaralingam R.; Dissegna M.; Boselli G., TCAD study of the Holding-Voltage Modulation in Irradiated SCR-LDMOS for HV ESD Protection, in: IEEE International Reliability Physics Symposium Proceedings, Institute of Electrical and Electronics Engineers Inc., «IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS», 2023, 2023-, pp. 1 - 6 (atti di: 61st IEEE International Reliability Physics Symposium, IRPS 2023, usa, 2023) [Contributo in Atti di convegno]
Balestra L.; Gnani E.; Reggiani S., Electron effective masses of Scx Al1- x N and Alx Ga1- x N from first-principles calculations of unfolded band structure, «JOURNAL OF APPLIED PHYSICS», 2022, 132, Article number: 215108, pp. 1 - 6 [articolo]Open Access
Balestra L.; Reggiani S.; Gnani E.; Gnudi A., Group velocity of electrons in 4H-SiC from Density Functional Theory simulations, «SOLID-STATE ELECTRONICS», 2022, 194, Article number: 108338, pp. 1 - 4 [articolo]Open Access
Balestra, L.; Reggiani, S.; Gnudi, A.; Gnani, E.; Dobrzynska, J.; Vobecky, J., On the breakdown voltage temperature dependence of high-voltage power diodes passivated with diamond-like carbon, «SOLID-STATE ELECTRONICS», 2022, 193, Article number: 108284, pp. 1 - 7 [articolo]Open Access
Luigi Balestra; Susanna Reggiani; Antonio Gnudi; Elena Gnani; Jan Vobeck{'{y}}; Umamaheswara Vemulapati, Current Instabilities in Large-Area Silicon Diodes: An Accurate TCAD Approach, in: ISPS' 21 Proceedings, 2021, pp. 49 - 53 (atti di: 15th INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS, Prague, Czech Republic, 26 August - 27 August 2021) [Contributo in Atti di convegno]
