Abstract
The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies, allowing the prototyping of high performance, Ultra low power and secured & safety System on Chip (SoC) solutions enabling competitive Artificial Intelligence (AI) for Edge applications. The main challenge addressed by the project is on one hand to handle the complexity of sub-28nm ‘more than moore’ technologies and to bring them up at a high maturity level and on the other hand to handle the design of complex SoCs for more intelligent, secure, flexible, low power consumption and cost effective. The project is targeting chipset and solutions with very efficient memories and high computing power targeting 10 Tops per Watt. The development of the most advanced automotive microcontrollers in FDSOI 28nm ePCM will be the support technology to demonstrate the high performances path as well as the robustness of the ePCM solution. The next generation of FDSOI ePCM will be main path for general purpose advanced microcontrollers usable for large volume Edge AI application in industrial and consumer markets with the best compromise on three requirements: performances, low power and adequate security. On top of the development and industrialization of silicon process lines and SoC design, storAIge will also address new design methodologies and tools to facilitate the exploitation of these advanced technology nodes, particularly for high performance microcontrollers having AI capabilities. Activities will be performed to setup robust and adequate Security and Safety level in the final applications, defining and implementing the good ‘mixture’ and tradeoff between HW and SW solutions to speed up adoption for large volume applications.
Project details
Unibo Team Leader: Eleonora Franchi Scarselli
Unibo involved Department/s:
Centro di Ricerca sui Sistemi Elettronici per l'Ingegneria dell'Informazione e delle Telecomunicazioni "Ercole De Castro" - ARCES (Advanced Research Center on Electronic System)
Coordinator:
Stmicroelectronics Crolles 2 Sas(France)
Other Participants:
Strikersoft Ab
(Sweden)
Csem Centre Suisse D'Electronique E De Microtechnique
(Switzerland)
Stmicroelectronics (Grenoble2) Sas
(France)
Université Grenoble Alpes
(France)
Université d'Aix-Marseille (AMU)
(France)
Fraunhofer Ipa
(Germany)
Cea-Commissariat A L'Energie Atomique Et Aux Energies Alternatives
(France)
Technische Universität Darmstadt Universitäts- und Landesbibliothek Darmstadt
(Germany)
Edc Electronic Design Chemnitz Gmbh
(Germany)
Arcelik A.S.
(Turkey)
S.O.I.Tec Silicon On Insulator Technologies Sa
(France)
Zf Friedrichshafen Ag
(Germany)
Consorzio Nazionale Interuniversitario Per La Nanoelettronica
(Italy)
Ford Otomotiv Sanayi A.S.
(Turkey)
Turkiye Bilimsel Ve Teknolojik Arastirma Kurumu
(Turkey)
Istanbul Medipol Universitesi Vafki
(Turkey)
Imec
(Belgium)
Stmicroelectronics Rousset Sas
(France)
Melexis Gmbh
(Germany)
Imms Institut Fuer Mikroelektronik- Und Mechatronik-Systeme Gmbh
(Germany)
UPPSALA UNIVERSITET - Uppsala Genome Center
(Sweden)
Buyutech Teknoloji Sanayi Ve Ticaret Anonim Sirketi
(Turkey)
Institut Mikroelektronickych Aplikaci S.R.O.
(Czech Republic)
Ustav Teorie Informace A Automatizace Av Cr Vvi-Institute Of Information Theory And Automation Of The Cas
(Czech Republic)
Stmicroelectronics
(France)
Thales Dis France Sa
(France)
X-Fab Global Services Gmbh
(Germany)
Università degli Studi di TORINO
(Italy)
STMicroelectronics S.r.l.
(Italy)
Atlas Copco Industrial Technique AB
(Sweden)
Cybertron Tech Gmbh
(Switzerland)
Turkcell Teknoloji Arastirma Ve Gelistirme Anonim Sirketi
(Turkey)
Knowtion Gmbh
(Germany)
Micro-Sensys Gmbh
(Germany)
X-FAB Dresden GmbH & Co. KG
(Germany)
Emmtrix Technologies Gmbh
(Germany)
KUNGL. TEKNISKA HOGSKOLAN - Royal Institute of Technology
(Sweden)
Endiio Engineering Gmbh
(Germany)
Pfeiffer Vacuum Italia S.P.A.
(Italy)
Third parties:
ALMA MATER STUDIORUM - Università di Bologna
(Italy)
Total Eu Contribution: Euro (EUR) 24.932.343,21
Project Duration in months: 36
Start Date:
01/07/2021
End Date:
30/06/2024
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 101007321