Microelectromechanical systems (MEMS) have become a key enabling technology for many of today’s high-technology products. Actually, it is the promise of MEMS supporting new breakthroughs in areas such as green energy, automotive and radical medical innovations that makes the MEMS industry a key for the fate of European advanced manufacturing as well as for the jobs, innovations and numerous applications (including security and defence) that MEMS have already enabled.
Lab4MEMS project aims to establish a European Pilot Line for innovative technologies on advanced piezoelectric and magnetic materials, including advanced Packaging technologies to meet the ever evolving market needs. The Pilot Line is promoted to reinforce the manufacturing facilities currently located in each respective participating country, aiming to implement and optimize the industrial processes and to validate the supply chains and the demonstrators suitable to penetrate the market. The locations are therefore distributed among the national clusters of the consortia, streaming the operations from front-end to back-end.
In particular, Lab4MEMS aims at introducing new classes of (non-CMOS) materials into the pilot line for innovative MEMS production, i.e. this project will leverage on piezoelectric PZT thin-film and materials featuring Anisotropic Magneto Resistance (AMR) such as permalloy (an alloy of NiFe with very low coercivity and a good sensitivity). Such materials will enable a variety of new key functionalities for next generation MEMS.
Lab4MEMs is also aiming at developing specific 3D package integration for MEMS products. In terms of packaging, the MEMS sensor has to face specific issues since it is not a simple static die but a moving machinery and/or sensing structure with particular constraints due to its function. The approach of Lab4MEMs will integrate the ASIC die & the MEMS sensors in a System in Package 3D configuration, thus enhancing the functionality and reliability while reducing the overall package size and cost, through exploitation of alternative interconnection technologies to the standard wire bonding process, e.g.: flip chip, Through Silicon Vias or Through Mold Vias.
In this way, Lab4MEMs will integrate the whole MEMS manufacturing chain, down to the new packaging processes, to show the viability for future “More than Moore” products and thus, open up new market opportunities for European industry.
Coordinator STMicroelectronics Ltd. (Malta)
Other participants:
Consorzio Nazionale Interuniversitario Per La Nanoelettronica-IUNET (Italy), di cui sono "terze parti":
Università di Pisa (Italy)
ALMA MATER STUDIORUM-UNIVERSITA DI BOLOGNA
- Centro di Ricerca sui Sistemi Elettronici per l'Ingegneria dell'Informazione e delle Telecomunicazioni "Ercole De Castro" - ARCES
- Resp. Scientifico: Prof. Marco Tartagni
Politecnico di Milano (Italy)
Politecnico di Torino (Italy)
STMicroelectronics S.r.l.. (Italy)
Cea-Commissariat À L’Energie Atomique Et Aux Energies Alternatives (France)
University of Malta (Malta)
Okmetic OYJ (Finland)
Teknologian Tutkimuskeskus Vtt (Finland)
Instytut Technologii Elektronowej (Poland)
ST-POLITO s.c.a.r.l. (Italy)
Picosun OY (Finland)
Istituto Italiano di Tecnologia (Italy)
SERMA Technologies SA (France)
SolMateS BV (The Netherlands)
Cavendish KINETICS BV (The Netherlands)
Icos Vision Systems Nv (Belgium)
Universitatea Politehnica Din Bucuresti (Romania)
Stiftelsen Sintef (Norway)
Sonitor Technologies AS (Norway)
Besi Austria GmbH (Austria)
Start date 01/01/2013
End date 30/06/2015
Duration 30 months
Project Reference 325622
Project cost 8.550.726 EURO
Project Funding 4.274.463 EURO
Area FP7-JTI-ENIAC
Subprogramme Area ENIAC Call 2012-2: Grand Challenge 2 “More than Moore”, Grand Challenge 3: “Opportunities in System-in-Package”, “Manufacturing”
Contract type ENIAC Joint Undertaking